disco corporation equipment for qrindinq of

DISCO CORPORATION (DSCSY) Company Profile & Facts Yahoo

See the company profile for DISCO CORPORATION (DSCSY) including business summary, industry/sector information, number of employees, business summary, corporate governance, key executives and their

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KABRA|DISCO Corporation

This ingot slicing method forms a flat lightabsorbing separation layer (KABRA layer *2) at a specified depth by irradiating a continuous, vertical laser from the upper surface of the SiC ingot, producing wafers. Conventional laser processing is not suitable for slicing because the modified layer formed by laser irradiation, in principle, extends in the direction of the laser incident (vertical).

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Disco Corp Company Profile and News Bloomberg Markets

DISCO CORPORATION manufactures abrasive and precision industrial machinery for cutting and grinding purposes. The Company''s products are applied

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Dicing Before Grinding (DBG) DISCO Technology Advancing

In DBG, first a halfcut is performed on the wafer with a dicing saw. Then, wafer thinning and die separation are performed at the same time during grinding. Because the thinned wafers are never transferred in DBG, waferlevel breakage is greatly reduced.

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Dicing Process using Blades (Blade Dicing) DISCO

Dicing is a process for cutting and making grooves using dicing blades. Dicing blades are abrasive blades that use synthetic diamond as the abrasive grit. The outer diameter of the dicing blade is approx. 50 mm and thickness is approx. 0.01 0.5 mm. There are various types of blades with different grit sizes, bond materials, and shapes.

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DISCO Corporation Company Profile Office Loions

Disco Corporation manufactures and sells precision cutting, grinding, and polishing machines. The Company''s precision machines include dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, as well as products for dicing before grinding process and package singulation.

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Wafer Mounter RAD2510F/12Sa Adwill:Semiconductor

In addition to regular ring frame mounting with 300mm/200mm wafers and removing of back grinding tape, this mounter supports the DBG (Dicing Before Grinding) process, which is ideal for thin die fabriion. 8.Inline compatible with DISCO Corporation''s DFG8000

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Product Information Grinder and Polisher DISCO Corporation

Grinders can thin silicon wafers, compound semiconductors, and many other types of materials with a high degree of accuracy. Processing for appliions which use the DBG system or DAF (Die attach film) is also possible by incorporating a polisher and wafer mounter with the grinder into an inline system*.

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DicingGrinding Service by DISCO dicinggrinding service

Customers can rely on DISCO precision tools and precision equipment by using the processing service DicingGrinding Service (DGS) loed in Munich. Please contact us for appliion consultation

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Used Disco Corporation Equipment Buy & Sell EquipNet

Disco Wafer Die Saws. Disco Corporation manufactures a wide range of fully automatic and automatic Wafer Die Saw for cutting semiconductor wafers. EquipNet carries a range of used Disco Corporation equipment, including fully automatic dicing saws.

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DISPF:OTC US Stock Quote Disco Corp Bloomberg Markets

About Disco Corp DISCO CORPORATION manufactures abrasive and precision industrial machinery for cutting and grinding purposes. The Company''s products are applied in the semiconductor, electronics

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Disco Corporation Production Equipment Japan

Company profile for solar equipment manufacturer Disco Corporation showing the company''s contact details and products manufactured. Disco Disco Corporation 2 Chome1311 Omorikita, Otaku, Tokyoto 1430016 +81 3 45901111: co.jp Wafer Grinding Equipment, Wafer Polishing Machine Last Update 15 Mar 2019

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DISCO CORP. Registered Shares o (D65.SG) company profile

See the company profile for DISCO CORP. Registered Shares o (D65.SG), including business summary, industry/sector information, number of employees, corporate governance, key

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DSCSY Disco Corp. ADR Overview MarketWatch

Disco Corp. ADR. DISCO Corp. engages in the manufacturing and sale of precision processing equipment. It operates through the following business

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Thinning by Grinding Wheel (Grinding) DISCO Technology

Grinding is a process in which an object is thinned and planarized by using a grinding wheel (abrasive tool for grinding). The workpiece is thinned and flattened by pressing the grinding wheel against it while rotating at a high speed.

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DISCO Corporation

Welcome to the official website of DISCO Corporation, manufacturer of precision processing equipment and tooling. This website offers a wide range of product and technology information related to our semiconductor processing equipment and information regarding our buyback and resale of used semiconductor equipment vestor relations, careers, and DISCO corporate information is also

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Disco Corporation (DSCSY) Yahoo Finance

See the company profile for DISCO CORPORATION (DSCSY) including business summary, industry/sector information, number of employees, business summary, corporate governance, key executives and their

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Solutions DISCO Corporation

As the leader in Kiru Kezuru Migaku technologies, DISCO pursues excellence in solutions support with decades of experience, a full range of processing equipment, and several thousand different grinding wheels, polishing wheels, and blades.

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Thin Wafer Processing and Dicing Equipment Market Growth

TAIKO, developed by DISCO Corporation, is a wafer back grinding process that uses a new grinding method. It is used for reducing the risk of thin wafer handling and lowering the warpage. The grinding process in TAIKO leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference.

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DISCO dicing saws and quality equipment dicinggrinding

DISCO HITEC EUROPE . DicingGrinding Service. Liebigstrasse 8 D85551 Kirchheim b. München Germany. Phone +49 89 909 030 Fax +49 89 909 03199. [email protected]

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DISCO CORPORATION : Shareholders Board Members Managers

DISCO CORPORATION is a Japanbased company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as well as the maintenance and related services business.

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Stock DISCO Stock Price Today Markets Insider

DISCO Corp. engages in the manufacturing and sale of precision processing equipment. It operates through the following business divisions: Precision Machines, Precision Processing Tools, and Other

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Dicing and Grinding Using the Conventional Process (TGM

Process Workflow 1: Processing by Each Equipment (StandAlone) (Each step is performed by standalone equipment) Protective tape (BG tape for backside grinding) is laminated onto the wafer surface''s circuit, the backside of the wafer is ground down to the designated thickness, and then the protective tape is removed from the wafer surface.

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disco corporation equipment for qrindinq of

About DISCO: DISCO HITEC EUROPE . It is the right place for needs related to the sale or maintenance of any dicing machine and blades, grinding equipment, laser cutter, DISCO Corporation.

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Dicing before Grinding (DBG) DISCO HITEC EUROPE Service

Nov 24, 2017 · com Dicing before grinding DBG DicingGrinding Sevice DISCO HITEC Europe . com Dicing before grinding DBG DicingGrinding Sevice DISCO HITEC Europe .

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6146.T DISCO CORPORATION Profile Reuters

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DISCO grinding and polishing machines and abrasive

View DISCO grinder and polisher available for DGS. Buy high quality grinding/polishing equipment

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DSCSY.PK DISCO CORPORATION Profile Reuters

About DISCO CORPORATION. DISCO CORPORATION is a Japanbased company mainly engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools, as

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Higher throughput grinder polisher for 300 mm wafers

with DISCO''s DBG (Dicing Before Grinding) process. DISCO 8000 Series compatibility The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method and GUI (Graphical User Interface) are based on proven 8000 Series technology.

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Thinning by Grinding Wheel (Grinding) DISCO Technology

Overview of Thinning by Grinding Wheel. Grinding is a process for making boardshaped workpieces thin (approx. less than 1 mm thick) and flat by using a grinding wheel. The grinding wheel is an abrasive which uses synthetic diamond. Wheel segments (thickness: several millimeters, height: 3 – 5 mm) are arranged along a ringshaped wheel base.

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DISCO Corp. Nikkei Asian Review

DISCO Corp. engages in the manufacturing and sale of precision processing equipment. It operates through the following business divisions: Precision Machines, Precision Processing Tools, and Other

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DISCO Corporation Company Profile: Stock Performance

Description. Disco Corp is a Japanbased company that manufactures and distributes precision processing and other manufacturing equipment. The firm''s product portfolio includes dicing saws, laser saws, grinders, polishers, wafer mounters, die separators, surface planers, water jet saws, dicing blades, grinding wheels, polishing wheels, and related products.

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Disco Corporation Wikipedia

DISCO Corporation (ディスコ, Kabushikigaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials grinders to process silicon and compound semiconductor wafers to ultrathin levels polishing machines to remove the grinding damage

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